1.What is Diamond wire ?
Diamond wire saw, of which Nexteck can offer is one of the most cost effective slicing for extremely hard materials, such as wafer, sapphire, silicon and ruby.
2.Product Description
․200 mm diameter capability
․High wire speeds up to 25 meters per second
․Rocking angle up to ± 12 degrees (24 degree total)
․Fast wire acceleration
․State of the art coolant spray nozzle technology
# These key machine features produce the lowest cycle times, best surface finishes and lowest possible diamond wire consumption which is a major cost factor in the process.
Rocking head 12 Deg (24 Deg total) reduces contact point, critical for slicing hard materials such as sapphire and ruby.
Fixed diamond particles electroplated to steel core wire. Wire kerf of 250µm + 5 to 20 micron additional kerf based on diamond wire mfg.
ALS, ATA, MT8, TIST 100, 300 grade, Highly transparency
Cover tape film with excellent sealing performance
Dicing Tape,fixing semicon, silicon, GaAs during dicing
Back Grinding Tape,protect circuit surface during back grinding
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